Solutions
From DFM to mass production — validated parts and processes for data centers, NEV automotive, and communication & IoT.
Pick Your Scenario
Each solution bundles typical parts, process controls and documents to shorten your NPI path.
Optical Modules & Switches
QSFP/QSFP-DD housings, heat-sinks and mechanical parts with thermal & EMI design.
Signal & HV Connectors
IATF16949 APQP/PPAP with traceability for HV & low-voltage connector housings.
Edge & Sensing Devices
Compact enclosures, antenna & thermal parts for gateways, CPE and sensors.
Optical Modules (Transceivers)
QSFP / QSFP-DD / OSFP / SFP families for optical transceivers only — housings, thermal parts and EMI-related components, from DFM to mass production.
mold → sample
critical dimensions
OTD (recent avg)
speed coverage
What we deliver
- Housings (top / bottom / base / lid), bezels, latch plates
- Heat-sinks / heat-spreaders, thermal interfaces
- Fasteners / shields as part of mechanical set
- Documents: Control Plan, PFMEA, FAI report, Cpk summary
Reference architecture
Materials & Finishes
Process & Quality
Parts gallery (placeholders)
Snapshot
Case QSFP-DD housing reached MP in 6 weeks from tooling kick-off.
Result OTD ≥ 98.5%, cosmetic NG < 0.8% in the first 3 months.
Next step
Share your drawing or request our standard model list — we’ll confirm DFM and lead time to samples & MP.
Signal & HV Connectors
Connector housings, shields and thermal parts for NEV HV & low-voltage systems — under IATF16949 with APQP/PPAP and full genealogy.
PPAP L3 typical
critical dims
OTD
customer quality
What we deliver
- Connector housings, shields, brackets, heat spreaders
- Insert & over-molding (plastics + metal)
- Markings & labeling for traceability
- Docs: PFMEA, Control Plan, MSA/GR&R, PPAP L3
Reference architecture
Materials & Finishes
Process & Quality
Parts gallery (placeholders)
Snapshot
Case HV connector housing PPAP L3 approved within 5 weeks.
Result Ramp to 20k+/mo, OTD ≥ 99%, 0 customer complaints in first 6 months.
Next step
Share specs or PPAP requirements — we’ll map a fast track from EVT to SOP.
Edge & Sensing Devices
Compact enclosures, RF shielding and thermal parts for gateways, CPE and sensors — rapid prototyping to mass production.
EVT → DVT
cosmetic target
OTD
RMA (12 mo)
What we deliver
- Enclosures, shields, heat-sinks, brackets
- Machining + plastics (injection / over-mold)
- Cosmetic spec & visual management
- Docs: FAI, SOP/WI, reliability test report
Reference architecture
Materials & Finishes
Process & Quality
Parts gallery (placeholders)
Snapshot
Case Gateway enclosure EVT→DVT in 4 weeks with cosmetic grade A.
Result RMA < 0.3% over 12 months; OTD ≥ 98.5%.
Next step
Need a compact enclosure or thermal part? Share your drawing and we’ll confirm DFM & lead time.
Have a drawing to review?
Send it to our engineers — we’ll return DFM notes and lead time to samples & MP.